- All sections
- H - Electricity
- H01L - Semiconductor devices not covered by class
- H01L 27/02 - Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
Patent holdings for IPC class H01L 27/02
Total number of patents in this class: 8448
10-year publication summary
|
755
|
921
|
985
|
967
|
1011
|
882
|
730
|
638
|
640
|
167
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Taiwan Semiconductor Manufacturing Company, Ltd. | 36809 |
1273 |
| Samsung Electronics Co., Ltd. | 131630 |
590 |
| Qualcomm Incorporated | 76576 |
248 |
| Texas Instruments Incorporated | 19376 |
247 |
| Boe Technology Group Co., Ltd. | 35384 |
241 |
| Intel Corporation | 45621 |
201 |
| Renesas Electronics Corporation | 6305 |
197 |
| GLOBALFOUNDRIES U.S. Inc. | 6459 |
174 |
| Micron Technology, Inc. | 24960 |
172 |
| United Microelectronics Corp. | 3921 |
171 |
| Infineon Technologies AG | 8189 |
144 |
| International Business Machines Corporation | 60644 |
134 |
| Socionext Inc. | 1575 |
128 |
| Changxin Memory Technologies, Inc. | 4732 |
97 |
| Rohm Co., Ltd. | 5843 |
94 |
| Semiconductor Components Industries, L.L.C. | 5345 |
94 |
| SK Hynix Inc. | 11030 |
91 |
| NXP USA, Inc. | 4155 |
88 |
| Semiconductor Energy Laboratory Co., Ltd. | 10902 |
87 |
| Monolithic 3D Inc. | 270 |
82 |
| Other owners | 3895 |